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Rochester Electronics HI4P0518-5
Manufacturer # :HI4P0518-5
Manufacturer :Rochester Electronics
Dasenic # :HI4P0518-5-DS
Datasheet : HI4P0518-5 Datasheet
Customer # :
Description : HIGH SPEED ANALOG MUX
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4026
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.327
Total :$ 6.33
Delivery :
Payment :
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Rochester Electronics HI4P0518-5 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:20-LCC (J-Lead)
- Supplier Device Package:20-PLCC (9x9)
- Number of Circuits:2
- Multiplexer/ Demultiplexer Circuit:4:1
- Switch Circuit:4PST - NO
- On- State Resistance ( Max):750Ohm
- Voltage - Supply, Single ( V+):±15V
- Voltage - Supply, Dual ( V±):±15V
- -3db Bandwidth:-
- Channel-to- Channel Matching (Δ Ron):-
- Switch Time ( Ton, Toff) ( Max):175ns, 175ns
- Charge Injection:-
- Channel Capacitance ( C S(off), C D(off)):5pF, 10pF
- Current - Leakage ( I S(off)) ( Max):10pA (Typ)
- Crosstalk:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HI4P0518-5 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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