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Rochester Electronics FS50R07N2E4_B11

IGBT MODULE
part number has RoHS
Manufacturer # :FS50R07N2E4_B11
Manufacturer :Rochester Electronics
Dasenic # :FS50R07N2E4_B11-DS
Customer # :
Description : IGBT MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 46.8540$ 46.85
25+$ 45.9180$ 1147.95
100+$ 44.0370$ 4403.7
500+$ 42.1650$ 21082.5
1000+$ 39.8250$ 39825
In Stock: 1753
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 46.854
Total :$ 46.85
Delivery :
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FS50R07N2E4_B11 information

  • Rochester Electronics FS50R07N2E4_B11 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Power - Max:190 W
  • Supplier Device Package:Module
  • Configuration:Three Phase Inverter
  • Input:Standard
  • Current - Collector ( Ic) ( Max):70 A
  • Voltage - Collector Emitter Breakdown ( Max):650 V
  • Current - Collector Cutoff ( Max):1 mA
  • I G B T Type:Trench Field Stop
  • Vce(on) ( Max) @ Vge, Ic:1.95V @ 15V, 50A
  • Input Capacitance ( Cies) @ Vce:3.1 nF @ 25 V
  • N T C Thermistor:Yes
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FS50R07N2E4_B11 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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