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Rochester Electronics F3L300R12ME4_B22

F3L300R12 - IGBT MODULE
part number has RoHS
Manufacturer # :F3L300R12ME4_B22
Manufacturer :Rochester Electronics
Dasenic # :F3L300R12ME4_B22-DS
Customer # :
Description : F3L300R12 - IGBT MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 304.9380$ 304.94
25+$ 298.8360$ 7470.9
100+$ 286.6410$ 28664.1
500+$ 274.4460$ 137223
1000+$ 259.2000$ 259200
In Stock: 1706
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 304.938
Total :$ 304.94
Delivery :
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  • Rochester Electronics F3L300R12ME4_B22 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Input Type:-
  • Power - Max:-
  • Supplier Device Package:-
  • Reverse Recovery Time (trr):-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Current - Collector Pulsed ( Icm):-
  • Switching Energy:-
  • Gate Charge:-
  • Td (on/off) @ 25° C:-
  • Test Condition:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
F3L300R12ME4_B22 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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