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Rochester Electronics EPF8636ARC208-4
LOADABLE PLD, CMOS, PQFP208
Manufacturer # :EPF8636ARC208-4
Manufacturer :Rochester Electronics
Dasenic # :EPF8636ARC208-4-DS
Datasheet :
EPF8636ARC208-4 Datasheet
EPF8636ARC208-4 DatasheetCustomer # :
Description : LOADABLE PLD, CMOS, PQFP208
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 34.3688 | $ 343.69 |
| 25+ | $ 33.6825 | $ 842.06 |
| 100+ | $ 32.3100 | $ 3231 |
| 500+ | $ 30.9375 | $ 15468.75 |
| 1000+ | $ 29.2163 | $ 29216.3 |
In Stock: 3360
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 34.3688
Total :$ 34.37
Delivery :
Payment :
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EPF8636ARC208-4 information
Rochester Electronics EPF8636ARC208-4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:208-BFQFP Exposed Pad
- Supplier Device Package:208-RQFP (28x28)
- Voltage - Supply:4.75V ~ 5.25V
- Number of I/ O:136
- Number of L A Bs/ C L Bs:63
- Number of Logic Elements/ Cells:504
- Number of gates:6000
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF8636ARC208-4 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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