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Rochester Electronics EP20K30EFC324-3
LOADABLE PLD, 3.98NS PBGA324
Manufacturer # :EP20K30EFC324-3
Manufacturer :Rochester Electronics
Dasenic # :EP20K30EFC324-3-DS
Datasheet :
EP20K30EFC324-3 Datasheet
EP20K30EFC324-3 DatasheetCustomer # :
Description : LOADABLE PLD, 3.98NS PBGA324
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 78.0099 | $ 78.01 |
| 25+ | $ 76.4571 | $ 1911.43 |
| 100+ | $ 73.3515 | $ 7335.15 |
| 500+ | $ 70.2459 | $ 35122.95 |
| 1000+ | $ 66.3269 | $ 66326.9 |
In Stock: 1599
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 78.0099
Total :$ 78.01
Delivery :
Payment :
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EP20K30EFC324-3 information
Rochester Electronics EP20K30EFC324-3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:324-BGA
- Supplier Device Package:324-FBGA (19x19)
- Voltage - Supply:1.71V ~ 1.89V
- Number of I/ O:128
- Number of L A Bs/ C L Bs:120
- Number of Logic Elements/ Cells:1200
- Number of gates:113000
- Total R A M bits:24576
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP20K30EFC324-3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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