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Texas Instruments DSD1700E

IC DAC/AUDIO 1BIT 28SSOP
part number has RoHS
Manufacturer # :DSD1700E
Manufacturer :Texas Instruments
Dasenic # :DSD1700E-DS
Customer # :
Description : IC DAC/AUDIO 1BIT 28SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.8480$ 7.85
25+$ 7.6950$ 192.38
100+$ 7.3800$ 738
500+$ 7.0650$ 3532.5
1000+$ 6.6690$ 6669
In Stock: 1537
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.848
Total :$ 7.85
Delivery :
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DSD1700E information

  • Texas Instruments DSD1700E technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:28-SSOP (0.209", 5.30mm Width)
  • Type:DAC, Audio
  • Number of Channels:2
  • Supplier Device Package:28-SSOP
  • Voltage - Supply:5V
  • Resolution ( Bits):1 b
  • Sampling Rate ( Per Second):-
  • Data Interface:DSD
  • Voltage Supply Source:Single Supply
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DSD1700E provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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