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Rochester Electronics DS1831C+
IC SUPERVISOR 4 CHANNEL 16DIP
Manufacturer # :DS1831C+
Manufacturer :Rochester Electronics
Dasenic # :DS1831C+-DS
Datasheet :
DS1831C+ Datasheet
DS1831C+ DatasheetCustomer # :
Description : IC SUPERVISOR 4 CHANNEL 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.6900 | $ 3.69 |
| 25+ | $ 3.6180 | $ 90.45 |
| 100+ | $ 3.4650 | $ 346.5 |
| 500+ | $ 3.3210 | $ 1660.5 |
| 1000+ | $ 3.1410 | $ 3141 |
In Stock: 11122
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.69
Total :$ 3.69
Delivery :
Payment :
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DS1831C+ information
Rochester Electronics DS1831C+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Supervisors
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Type:Multi-Voltage Supervisor
- Supplier Device Package:16-PDIP
- Output:Open Drain or Open Collector
- Reset:Active Low
- Number of Voltages Monitored:4
- Voltage - Threshold:2.5V, 3.3V, Adj, Adj
- Reset Timeout:10ms; 100ms; 1,000ms Minimum
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS1831C+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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