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Rochester Electronics CY8C5468AXI-018
Manufacturer # :CY8C5468AXI-018
Manufacturer :Rochester Electronics
Dasenic # :CY8C5468AXI-018-DS
Datasheet : CY8C5468AXI-018 Datasheet
Customer # :
Description : IC MCU 32BIT 256KB FLASH 100TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 51806
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.758
Total :$ 16.76
Delivery :
Payment :
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CY8C5468AXI-018 information
Rochester Electronics CY8C5468AXI-018 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Supplier Device Package:100-TQFP (14x14)
- Peripherals:CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/ O:60
- Speed:67MHz
- E E P R O M Size:2K x 8
- Core Processor:ARM® Cortex®-M3
- R A M Size:64K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:I²C, LINbus, SPI, UART/USART, USB
- Program Memory Size:256KB (256K x 8)
- Voltage - Supply ( Vcc/ Vdd):2.7V ~ 5.5V
- Data Converters:A/D 2x12b; D/A 4x8b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- US ECCN:3A991A3
- HTS US:8542.31.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY8C5468AXI-018 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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