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Rochester Electronics CY7C4231V-25AXC

IC SYNC FIFO MEM 2KX9 32-TQFP
part number has RoHS
Manufacturer # :CY7C4231V-25AXC
Manufacturer :Rochester Electronics
Dasenic # :CY7C4231V-25AXC-DS
Customer # :
Description : IC SYNC FIFO MEM 2KX9 32-TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 23.0400$ 23.04
25+$ 22.5800$ 564.5
100+$ 21.6600$ 2166
500+$ 20.7400$ 10370
1000+$ 19.5800$ 19580
In Stock: 1520
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 23.04
Total :$ 23.04
Delivery :
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CY7C4231V-25AXC information

  • Rochester Electronics CY7C4231V-25AXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:32-TQFP
  • Supplier Device Package:32-TQFP (7x7)
  • Memory Size:18K (2K x 9)
  • Voltage - Supply:3 V ~ 3.6 V
  • Current - Supply ( Max):20mA
  • Data Rate:40MHz
  • Access Time:15ns
  • Bus Directional:Uni-Directional
  • Expansion Type:Depth, Width
  • Programmable Flags Support:Yes
  • Retransmit Capability:No
  • F W F T Support:No
  • Function:Synchronous
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY7C4231V-25AXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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