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Rochester Electronics CY7C144AV-25ACKJ

DUAL PORT RAM
part number has RoHS
Manufacturer # :CY7C144AV-25ACKJ
Manufacturer :Rochester Electronics
Dasenic # :CY7C144AV-25ACKJ-DS
Customer # :
Description : DUAL PORT RAM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 27.5000$ 27.5
25+$ 26.9600$ 674
100+$ 25.8600$ 2586
500+$ 24.7600$ 12380
1000+$ 23.3800$ 23380
In Stock: 1504
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.5
Total :$ 27.50
Delivery :
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Payment :
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CY7C144AV-25ACKJ information

  • Rochester Electronics CY7C144AV-25ACKJ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LQFP
  • Technology:SRAM - Dual Port, Asynchronous
  • Supplier Device Package:64-TQFP (14x14)
  • Memory Size:64Kb (8K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:3V ~ 3.6V
  • Clock Frequency:-
  • Access Time:25 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:25ns
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.32.0041
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C144AV-25ACKJ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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