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Rochester Electronics CY62128BNLL-55ZXIT

IC SRAM 1MBIT PARALLEL 32TSOP I
part number has RoHS
Manufacturer # :CY62128BNLL-55ZXIT
Manufacturer :Rochester Electronics
Dasenic # :CY62128BNLL-55ZXIT-DS
Customer # :
Description : IC SRAM 1MBIT PARALLEL 32TSOP I
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
7+$ 0.6264$ 4.38
10+$ 0.6139$ 6.14
100+$ 0.5951$ 59.51
500+$ 0.5763$ 288.15
1000+$ 0.5638$ 563.8
In Stock: 19120
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6264
Total :$ 0.63
Delivery :
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Payment :
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CY62128BNLL-55ZXIT information

  • Rochester Electronics CY62128BNLL-55ZXIT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-TFSOP (0.724", 18.40mm Width)
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:32-TSOP I
  • Memory Size:1Mb (128K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:-
  • Access Time:55 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY62128BNLL-55ZXIT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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