Name: CD74HC377E
Brand: Texas Instruments
SKU: DS-5882166
Price: 0.325 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments CD74HC377E

IC FF D-TYPE SNGL 8BIT 20DIP

Manufacturer # :CD74HC377E

Manufacturer :Texas Instruments

Dasenic # :CD74HC377E-DS

Datasheet :

CD74HC377E Datasheet

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Description : IC FF D-TYPE SNGL 8BIT 20DIP

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Quantity	Unit Price	Total
1+	$ 0.3250	$ 0.33
25+	$ 0.3185	$ 7.96
100+	$ 0.3055	$ 30.55
500+	$ 0.2925	$ 146.25
1000+	$ 0.2762	$ 276.2

In Stock: 36754

MOQ :1 PCS

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Unit Price :$ 0.325

Total :$ 0.33

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CD74HC377E information

Texas Instruments CD74HC377E technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Logic - Flip Flops
Product Status:Active
Operating Temperature:-55°C ~ 125°C (TA)
Mounting Type:Through Hole
Package / Case:20-DIP (0.300", 7.62mm)
Type:D-Type
Output Type:Non-Inverted
Supplier Device Package:20-PDIP
Number of Elements:1
Voltage - Supply:2V ~ 6V
Clock Frequency:60 MHz
Number of Bits per Element:8
Current - Output High, Low:5.2mA, 5.2mA
Max Propagation Delay @ V, Max C L:30ns @ 6V, 50pF
Current - Quiescent ( Iq):8 µA
Trigger Type:Positive Edge
Input Capacitance:10 pF
Function:Standard
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments CD74HC377E
Datasheet:
CD74HC377E,

Texas Instruments CD74HC377E Environmental and export classification status description
The Texas Instruments CD74HC377E is a high-speed CMOS integrated circuit from the 74HC family. It is an octal D-type flip-flop with a buffered common clock and asynchronous reset. The IC comes in a 20-pin dual in-line package (DIP) and operates over a wide voltage range. Functions: 1. Octal D-type flip-flop: The IC contains eight individual D-type flip-flops. 2. Buffered common clock: Allows all flip-flops to be clocked simultaneously. 3. Asynchronous reset: Allows resetting all flip-flops independently of the clock. Applications: 1. Shift registers 2. Register storage 3. Addressable latches 4. Data storage and transfer applications Alternative Components: 1. SN74HC377 from Texas Instruments 2. 74HC377 from NXP Semiconductors 3. MC74HC377 from ON Semiconductor Embedded Modules: 1. D-type flip-flop 2. Clock buffer 3. Asynchronous reset circuit Q&A: 1. What is the maximum clock frequency supported by the CD74HC377E? - The CD74HC377E can typically support clock frequencies up to 25 MHz. 2. Can the outputs of the flip-flops be cascaded? - Yes, the outputs of the individual flip-flops can be cascaded to create larger storage or shift register configurations. 3. How does the asynchronous reset function work in the IC? - The asynchronous reset allows resetting the flip-flops independent of the clock signal, ensuring a reliable reset operation. 4. What is the power supply range for the CD74HC377E? - The IC operates over a wide voltage range, typically from 2V to 6V. 5. Are there any specific setup and hold time requirements for the inputs? - The CD74HC377E typically requires setup and hold times for the inputs to ensure proper operation and data integrity. Check the datasheet for detailed timing specifications.

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CD74HC377E provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.