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Rochester Electronics CD74FCT162823ATMT
Manufacturer # :CD74FCT162823ATMT
Manufacturer :Rochester Electronics
Dasenic # :CD74FCT162823ATMT-DS
Datasheet : CD74FCT162823ATMT Datasheet
Customer # :
Description : FAST CMOS 18-BIT REGISTER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1641
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.205
Total :$ 2.21
Delivery :
Payment :
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CD74FCT162823ATMT information
Rochester Electronics CD74FCT162823ATMT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:56-TFSOP (0.240", 6.10mm Width)
- Type:D-Type
- Output Type:Tri-State, Non-Inverted
- Supplier Device Package:56-SSOP
- Number of Elements:2
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:-
- Number of Bits per Element:9
- Current - Output High, Low:24mA, 24mA
- Max Propagation Delay @ V, Max C L:20ns @ 5V, 300pF
- Current - Quiescent ( Iq):500 µA
- Trigger Type:Positive Edge
- Input Capacitance:4.5 pF
- Function:Standard
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74FCT162823ATMT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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