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Rochester Electronics CD54HCT173F3A

D FLIP-FLOP, HCT SERIES, 4-BIT
part number has RoHS
Manufacturer # :CD54HCT173F3A
Manufacturer :Rochester Electronics
Dasenic # :CD54HCT173F3A-DS
Customer # :
Description : D FLIP-FLOP, HCT SERIES, 4-BIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 18.7200$ 18.72
In Stock: 1603
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.72
Total :$ 18.72
Delivery :
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CD54HCT173F3A information

  • Rochester Electronics CD54HCT173F3A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Flip Flops
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:16-CDIP (0.300", 7.62mm)
  • Type:D-Type
  • Output Type:Tri-State, Non-Inverted
  • Supplier Device Package:16-CDIP
  • Number of Elements:1
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:60 MHz
  • Number of Bits per Element:4
  • Current - Output High, Low:6mA, 6mA
  • Max Propagation Delay @ V, Max C L:40ns @ 4.5V, 50pF
  • Current - Quiescent ( Iq):8 µA
  • Trigger Type:Positive Edge
  • Input Capacitance:10 pF
  • Function:Master Reset
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CD54HCT173F3A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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