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Rochester Electronics CD54HC139FX
HIGH-SPEED CMOS LOGIC DUAL 2-TO
Manufacturer # :CD54HC139FX
Manufacturer :Rochester Electronics
Dasenic # :CD54HC139FX-DS
Datasheet :
CD54HC139FX Datasheet
CD54HC139FX DatasheetCustomer # :
Description : HIGH-SPEED CMOS LOGIC DUAL 2-TO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.5063 | $ 1.51 |
| 200+ | $ 0.5842 | $ 116.84 |
| 500+ | $ 0.5628 | $ 281.4 |
| 1000+ | $ 0.5527 | $ 552.7 |
In Stock: 2918
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.5063
Total :$ 1.51
Delivery :
Payment :
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CD54HC139FX information
Rochester Electronics CD54HC139FX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:16-CDIP (0.300", 7.62mm)
- Type:Decoder/Demultiplexer
- Supplier Device Package:16-CDIP
- Voltage - Supply:2V ~ 6V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:5.2mA, 5.2mA
- Circuit:1 x 2:4
- Independent Circuits:2
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD54HC139FX provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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