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1 : $0.7416
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Rochester Electronics CD4066BE
IC BILATERAL SW 1 X 1:1 14DIP
Manufacturer # :CD4066BE
Manufacturer :Rochester Electronics
Dasenic # :CD4066BE-DS
Datasheet :
CD4066BE Datasheet
CD4066BE DatasheetCustomer # :
Description : IC BILATERAL SW 1 X 1:1 14DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.7416 | $ 0.74 |
| 10+ | $ 0.5544 | $ 5.54 |
| 25+ | $ 0.5067 | $ 12.67 |
| 100+ | $ 0.4338 | $ 43.38 |
| 250+ | $ 0.3879 | $ 96.98 |
In Stock: 20152
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7416
Total :$ 0.74
Delivery :
Payment :
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CD4066BE information
Rochester Electronics CD4066BE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Type:Bilateral, FET Switches
- Supplier Device Package:14-PDIP
- Voltage - Supply:3V ~ 18V
- Voltage Supply Source:Dual Supply
- Current - Output High, Low:-
- Circuit:1 x 1:1
- Independent Circuits:4
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD4066BE provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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