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Rochester Electronics CD22M3493E
12 X 8 X 1 CROSSPOINT SWITCH
Manufacturer # :CD22M3493E
Manufacturer :Rochester Electronics
Dasenic # :CD22M3493E-DS
Datasheet :
CD22M3493E Datasheet
CD22M3493E DatasheetCustomer # :
Description : 12 X 8 X 1 CROSSPOINT SWITCH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.1050 | $ 3.11 |
| 25+ | $ 3.0420 | $ 76.05 |
| 100+ | $ 2.9160 | $ 291.6 |
| 500+ | $ 2.7990 | $ 1399.5 |
| 1000+ | $ 2.6370 | $ 2637 |
In Stock: 1568
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.105
Total :$ 3.10
Delivery :
Payment :
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CD22M3493E information
Rochester Electronics CD22M3493E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:40-DIP (0.600", 15.24mm)
- Type:Crosspoint Switch
- Supplier Device Package:40-PDIP
- Voltage - Supply:4V ~ 16V
- Voltage Supply Source:Dual Supply
- Current - Output High, Low:-
- Circuit:1 x 8:12
- Independent Circuits:1
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD22M3493E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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