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Rochester Electronics BGA771L16E6327
HIGH LINEAR DUAL-BAND UMTS LNA
Manufacturer # :BGA771L16E6327
Manufacturer :Rochester Electronics
Dasenic # :BGA771L16E6327-DS
Datasheet :
BGA771L16E6327 Datasheet
BGA771L16E6327 DatasheetCustomer # :
Description : HIGH LINEAR DUAL-BAND UMTS LNA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.4941 | $ 0.49 |
| 10+ | $ 0.4698 | $ 4.7 |
| 100+ | $ 0.4464 | $ 44.64 |
| 1000+ | $ 0.4239 | $ 423.9 |
| 10000+ | $ 0.4023 | $ 4023 |
In Stock: 13928
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4941
Total :$ 0.49
Delivery :
Payment :
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BGA771L16E6327 information
Rochester Electronics BGA771L16E6327 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Amplifiers
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:6-XFDFN Exposed Pad
- Frequency:800MHz, 900MHz
- Current - Supply:3.3mA
- Supplier Device Package:PG-TSLP-7-1
- Voltage - Supply:2.6V ~ 3V
- Gain:15.8dB
- Noise Figure:1.05dB
- P1d B:-5dBm
- R F Type:UMTS
- Test Frequency:800MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BGA771L16E6327 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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