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Rochester Electronics AIC111RHB
IC AUDIO CODEC 16B 32VQFN
Manufacturer # :AIC111RHB
Manufacturer :Rochester Electronics
Dasenic # :AIC111RHB-DS
Datasheet :
AIC111RHB Datasheet
AIC111RHB DatasheetCustomer # :
Description : IC AUDIO CODEC 16B 32VQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.8113 | $ 0.81 |
| 25+ | $ 0.7951 | $ 19.88 |
| 100+ | $ 0.7626 | $ 76.26 |
| 500+ | $ 0.7302 | $ 365.1 |
| 1000+ | $ 0.6896 | $ 689.6 |
In Stock: 1634
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.8113
Total :$ 0.81
Delivery :
Payment :
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AIC111RHB information
Rochester Electronics AIC111RHB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad
- Type:Voice-Band
- Supplier Device Package:32-VQFN (5x5)
- Resolution ( Bits):16 b
- Data Interface:Serial
- Voltage - Supply, Analog:1.1V ~ 1.5V
- Voltage - Supply, Digital:1.1V ~ 1.5V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:Yes
- S/ N Ratio, A D Cs / D A Cs (db) Typ:-
- Dynamic Range, A D Cs / D A Cs (db) Typ:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AIC111RHB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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