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Rochester Electronics ADR06AR

IC VREF SERIES PREC 3V 8-SOIC
part number has RoHS
Manufacturer # :ADR06AR
Manufacturer :Rochester Electronics
Dasenic # :ADR06AR-DS
Customer # :
Description : IC VREF SERIES PREC 3V 8-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.4490$ 1.45
25+$ 1.4220$ 35.55
100+$ 1.3590$ 135.9
500+$ 1.3050$ 652.5
1000+$ 1.2330$ 1233
In Stock: 12384
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.449
Total :$ 1.45
Delivery :
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Payment :
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ADR06AR information

  • Rochester Electronics ADR06AR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
  • Product Status:Obsolete
  • Tolerance:-
  • Temperature Coefficient:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Current - Supply:-
  • Voltage - Input:-
  • Output Type:-
  • Supplier Device Package:8-SOIC
  • Reference Type:-
  • Current - Output:-
  • Voltage - Output ( Min/ Fixed):-
  • Voltage - Output ( Max):-
  • Noise - 0.1 Hz to 10 Hz:-
  • Noise - 10 Hz to 10k Hz:-
  • Current - Cathode:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADR06AR provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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