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1 : $0.6143
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Rochester Electronics ADP3157JR-REEL
IC CNTRL SYNC PENTIUM III 16SOIC
Manufacturer # :ADP3157JR-REEL
Manufacturer :Rochester Electronics
Dasenic # :ADP3157JR-REEL-DS
Datasheet :
ADP3157JR-REEL Datasheet
ADP3157JR-REEL DatasheetCustomer # :
Description : IC CNTRL SYNC PENTIUM III 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.6143 | $ 0.61 |
| 25+ | $ 0.6020 | $ 15.05 |
| 100+ | $ 0.5774 | $ 57.74 |
| 500+ | $ 0.5529 | $ 276.45 |
| 1000+ | $ 0.5222 | $ 522.2 |
In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6143
Total :$ 0.61
Delivery :
Payment :
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ADP3157JR-REEL information
Rochester Electronics ADP3157JR-REEL technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Special Purpose
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Voltage - Input:12V
- Supplier Device Package:16-SOIC
- Voltage - Output:1.3V ~ 3.5V
- Number of Outputs:-
- Applications:Controller, Intel Pentium® III
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADP3157JR-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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