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1 : $3.3390
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Rochester Electronics ADM8697ANZ
IC SUPERVISOR 1 CHANNEL 16DIP
Manufacturer # :ADM8697ANZ
Manufacturer :Rochester Electronics
Dasenic # :ADM8697ANZ-DS
Datasheet :
ADM8697ANZ Datasheet
ADM8697ANZ DatasheetCustomer # :
Description : IC SUPERVISOR 1 CHANNEL 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.3390 | $ 3.34 |
| 25+ | $ 3.2760 | $ 81.9 |
| 100+ | $ 3.1410 | $ 314.1 |
| 500+ | $ 3.0060 | $ 1503 |
| 1000+ | $ 2.8350 | $ 2835 |
In Stock: 9493
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.339
Total :$ 3.34
Delivery :
Payment :
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ADM8697ANZ information
Rochester Electronics ADM8697ANZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Supervisors
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Type:Battery Backup Circuit
- Supplier Device Package:16-PDIP
- Output:Push-Pull, Push-Pull
- Reset:Active High/Active Low
- Number of Voltages Monitored:1
- Voltage - Threshold:1.3V
- Reset Timeout:35ms Minimum
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADM8697ANZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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