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Rochester Electronics ADG3241BKS-REEL

IC SW BUS 2.5/3.3V 1BIT SC70-6
part number has RoHS
Manufacturer # :ADG3241BKS-REEL
Manufacturer :Rochester Electronics
Dasenic # :ADG3241BKS-REEL-DS
Customer # :
Description : IC SW BUS 2.5/3.3V 1BIT SC70-6
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.5362$ 0.54
25+$ 0.5255$ 13.14
100+$ 0.5041$ 50.41
500+$ 0.4826$ 241.3
1000+$ 0.4558$ 455.8
In Stock: 59689
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5362
Total :$ 0.54
Delivery :
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Payment :
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ADG3241BKS-REEL information

  • Rochester Electronics ADG3241BKS-REEL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:6-TSSOP, SC-88, SOT-363
  • Type:Bus Switch
  • Supplier Device Package:SC-70-6
  • Voltage - Supply:2.5V, 3.3V
  • Voltage Supply Source:Single Supply
  • Current - Output High, Low:-
  • Circuit:1 x 1:1
  • Independent Circuits:1
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADG3241BKS-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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