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Rochester Electronics ADCLK907BCPZ-WP

IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
part number has RoHS
Manufacturer # :ADCLK907BCPZ-WP
Manufacturer :Rochester Electronics
Dasenic # :ADCLK907BCPZ-WP-DS
Customer # :
Description : IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 19.1430$ 19.14
10+$ 13.9716$ 139.72
25+$ 12.6436$ 316.09
1000+$ 7.5600$ 7560
In Stock: 18817
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 19.143
Total :$ 19.14
Delivery :
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ADCLK907BCPZ-WP information

  • Rochester Electronics ADCLK907BCPZ-WP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:16-VFQFN Exposed Pad, CSP
  • Type:Buffer/Driver, Data
  • Supplier Device Package:16-LFCSP-VQ (3x3)
  • Frequency - Max:7.5 GHz
  • Number of Circuits:2
  • Output:ECL, NECL, PECL
  • Voltage - Supply:2.375V ~ 3.63V
  • Input:Clock
  • Ratio - Input: Output:1:1
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADCLK907BCPZ-WP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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