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Rochester Electronics AD7892ARZ-3

IC ADC 12BIT SAR 24SOIC
part number has RoHS
Manufacturer # :AD7892ARZ-3
Manufacturer :Rochester Electronics
Dasenic # :AD7892ARZ-3-DS
Customer # :
Description : IC ADC 12BIT SAR 24SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 41.2740$ 41.27
1000+$ 25.0650$ 25065
In Stock: 8091
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 41.274
Total :$ 41.27
Delivery :
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  • Rochester Electronics AD7892ARZ-3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Analog to Digital Converters (ADC)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:24-SOIC (0.295", 7.50mm Width)
  • Input Type:Single Ended
  • Supplier Device Package:24-SOIC
  • Configuration:S/H-ADC
  • Sampling Rate ( Per Second):600k
  • Data Interface:SPI, Parallel
  • Number of Bits:12
  • Voltage - Supply, Analog:5V
  • Voltage - Supply, Digital:5V
  • Number of Inputs:2
  • Ratio - S/ H: A D C:1:1
  • Number of A/ D Converters:1
  • Architecture:SAR
  • Reference Type:External, Internal
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD7892ARZ-3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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