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Rochester Electronics AD7679ACPRL

IC ADC 18BIT SAR W/BUFF 48-LFCSP
part number has RoHS
Manufacturer # :AD7679ACPRL
Manufacturer :Rochester Electronics
Dasenic # :AD7679ACPRL-DS
Customer # :
Description : IC ADC 18BIT SAR W/BUFF 48-LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.0010$ 17
100+$ 15.8109$ 1581.09
1000+$ 15.3009$ 15300.9
10000+$ 14.4509$ 144509
In Stock: 52443
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.001
Total :$ 17.00
Delivery :
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  • Rochester Electronics AD7679ACPRL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Analog to Digital Converters (ADC)
  • Product Status:Active
  • Operating Temperature:-
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:48-VFQFN Exposed Pad, CSP
  • Input Type:-
  • Supplier Device Package:48-LFCSP-VQ (7x7)
  • Configuration:-
  • Sampling Rate ( Per Second):-
  • Data Interface:-
  • Number of Bits:18
  • Voltage - Supply, Analog:-
  • Voltage - Supply, Digital:-
  • Number of Inputs:-
  • Ratio - S/ H: A D C:-
  • Number of A/ D Converters:-
  • Architecture:-
  • Reference Type:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD7679ACPRL provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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