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Rochester Electronics AD5346BCP

IC DAC 8BIT OCTAL VOUT 40-LFCSP
part number has RoHS
Manufacturer # :AD5346BCP
Manufacturer :Rochester Electronics
Dasenic # :AD5346BCP-DS
Customer # :
Description : IC DAC 8BIT OCTAL VOUT 40-LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.9897$ 3.99
10+$ 3.7899$ 37.9
100+$ 3.6009$ 360.09
1000+$ 3.4200$ 3420
10000+$ 3.2490$ 32490
In Stock: 35938
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.9897
Total :$ 3.99
Delivery :
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AD5346BCP information

  • Rochester Electronics AD5346BCP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:40-WFQFN Exposed Pad, CSP
  • Output Type:-
  • Supplier Device Package:40-LFCSP-WQ (6x6)
  • Data Interface:-
  • Number of Bits:-
  • Voltage - Supply, Analog:-
  • Voltage - Supply, Digital:-
  • Architecture:-
  • Reference Type:-
  • Number of D/ A Converters:-
  • Settling Time:-
  • Differential Output:-
  • I N L/ D N L ( L S B):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD5346BCP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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