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Rochester Electronics AD22103KR-REEL7

IC TEMP SNSR 3.3V SGNLCOND 8SOIC
part number has RoHS
Manufacturer # :AD22103KR-REEL7
Manufacturer :Rochester Electronics
Dasenic # :AD22103KR-REEL7-DS
Customer # :
Description : IC TEMP SNSR 3.3V SGNLCOND 8SOIC 8-SOIC (0.154", 3.90mm Width)
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.6650$ 1.67
25+$ 1.6290$ 40.73
100+$ 1.5660$ 156.6
500+$ 1.5030$ 751.5
1000+$ 1.4130$ 1413
In Stock: 20400
MOQ :1 PCS
Packaging :8-SOIC (0.154", 3.90mm Width)
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.665
Total :$ 1.67
Delivery :
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Payment :
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AD22103KR-REEL7 information

  • Rochester Electronics AD22103KR-REEL7 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
  • Product Status:Obsolete
  • Operating Temperature:-
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Output Type:-
  • Supplier Device Package:8-SOIC
  • Resolution:-
  • Voltage - Supply:-
  • Sensor Type:-
  • Test Condition:-
  • Sensing Temperature - Local:-
  • Sensing Temperature - Remote:-
  • Accuracy - Highest ( Lowest):-
AD22103KR-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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