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Rochester Electronics 74HC193DB112

74HC193DB - BINARY COUNTER, HC/
part number has RoHS
Manufacturer # :74HC193DB112
Manufacturer :Rochester Electronics
Dasenic # :74HC193DB112-DS
Customer # :
Description : 74HC193DB - BINARY COUNTER, HC/
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.8930$ 2.89
25+$ 2.8355$ 70.89
100+$ 2.7197$ 271.97
500+$ 2.6040$ 1302
1000+$ 2.4593$ 2459.3
In Stock: 3273
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.893
Total :$ 2.89
Delivery :
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Payment :
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74HC193DB112 information

  • Rochester Electronics 74HC193DB112 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Counters, Dividers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:16-SSOP (0.209", 5.30mm Width)
  • Direction:Up, Down
  • Supplier Device Package:16-SSOP
  • Number of Elements:1
  • Voltage - Supply:2 V ~ 6 V
  • Logic Type:Binary Counter
  • Number of Bits per Element:4
  • Reset:Asynchronous
  • Timing:Synchronous
  • Count Rate:49 MHz
  • Trigger Type:Positive Edge
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74HC193DB112 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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