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Rochester Electronics 3MN03SF-TL-E

BIP NPN 30MA 20V
part number has RoHS
Manufacturer # :3MN03SF-TL-E
Manufacturer :Rochester Electronics
Dasenic # :3MN03SF-TL-E-DS
Customer # :
Description : BIP NPN 30MA 20V
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0410$ 0.04
25+$ 0.0401$ 1
100+$ 0.0385$ 3.85
500+$ 0.0369$ 18.45
1000+$ 0.0348$ 34.8
In Stock: 16845
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.041
Total :$ 0.04
Delivery :
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Payment :
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3MN03SF-TL-E information

  • Rochester Electronics 3MN03SF-TL-E technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - RF
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:3-SMD, Flat Lead
  • Power - Max:150mW
  • Supplier Device Package:3-SSFP
  • Transistor Type:NPN
  • Current - Collector ( Ic) ( Max):30mA
  • Voltage - Collector Emitter Breakdown ( Max):20V
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:60 @ 1mA, 6V
  • Frequency - Transition:320MHz
  • Noise Figure (d B Typ @ f):3dB @ 100MHz
  • Gain:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
3MN03SF-TL-E provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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