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Rochester Electronics R1LV0216BSB-7SI#B0

IC SRAM 2MBIT PARALLEL 44TSOP II
part number has RoHS
Manufacturer # :R1LV0216BSB-7SI#B0
Manufacturer :Rochester Electronics
Dasenic # :R1LV0216BSB-7SI#B0-DS
Customer # :
Description : IC SRAM 2MBIT PARALLEL 44TSOP II
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
7+$ 2.2221$ 15.55
10+$ 2.1776$ 21.78
100+$ 2.1110$ 211.1
500+$ 2.0444$ 1022.2
1000+$ 1.9999$ 1999.9
In Stock: 23925
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.2221
Total :$ 2.22
Delivery :
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Payment :
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R1LV0216BSB-7SI#B0 information

  • Rochester Electronics R1LV0216BSB-7SI#B0 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-TSOP (0.400", 10.16mm Width)
  • Technology:SRAM
  • Supplier Device Package:44-TSOP II
  • Memory Size:2Mb (128K x 16)
  • Memory Type:Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:-
  • Access Time:70 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:70ns
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:3A991B2A
  • HTS US:8542.32.0041
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
R1LV0216BSB-7SI#B0 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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