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Rochester Electronics ISL9000IRMMZ-T
Manufacturer # :ISL9000IRMMZ-T
Manufacturer :Rochester Electronics
Dasenic # :ISL9000IRMMZ-T-DS
Datasheet : ISL9000IRMMZ-T Datasheet
Customer # :
Description : IC REG LINEAR 3V/3V 300MA 10DFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7830
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.125
Total :$ 1.13
Delivery :
Payment :
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Rochester Electronics ISL9000IRMMZ-T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:10-VFDFN Exposed Pad
- Output Type:Fixed
- Voltage - Input ( Max):6.5V
- Supplier Device Package:10-DFN (3x3)
- Current - Supply ( Max):52 µA
- Current - Output:300mA, 300mA
- Current - Quiescent ( Iq):32 µA
- Control Features:Enable, Power On Reset
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):3V, 3V
- Voltage - Output ( Max):-
- Number of Regulators:2
- Voltage Dropout ( Max):0.325V @ 300mA, 0.325V @ 300mA
- P S R R:-
- Protection Features:Over Current, Over Temperature, Under Voltage Lockout (UVLO)
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ISL9000IRMMZ-T provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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