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Rochester Electronics ISL55004IB-T13
Manufacturer # :ISL55004IB-T13
Manufacturer :Rochester Electronics
Dasenic # :ISL55004IB-T13-DS
Datasheet : ISL55004IB-T13 Datasheet
Customer # :
Description : IC OPAMP VFB 4 CIRCUIT 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 13892
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.016
Total :$ 2.02
Delivery :
Payment :
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ISL55004IB-T13 information
Rochester Electronics ISL55004IB-T13 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Current - Supply:8.5mA (x4 Channels)
- Output Type:-
- Supplier Device Package:14-SOIC
- Number of Circuits:4
- Amplifier Type:Voltage Feedback
- -3db Bandwidth:200 MHz
- Current - Output / Channel:140 mA
- Slew Rate:300V/µs
- Gain Bandwidth Product:70 MHz
- Current - Input Bias:600 nA
- Voltage - Input Offset:1.2 mV
- Voltage - Supply Span ( Min):4.5 V
- Voltage - Supply Span ( Max):30 V
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.33.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ISL55004IB-T13 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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