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Rochester Electronics SSU1N50BTU
Manufacturer # :SSU1N50BTU
Manufacturer :Rochester Electronics
Dasenic # :SSU1N50BTU-DS
Datasheet : SSU1N50BTU Datasheet
Customer # :
Description : 1.3A, 520V, 5.3OHM, N-CHANNEL,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5369
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3281
Total :$ 0.33
Delivery :
Payment :
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SSU1N50BTU information
Rochester Electronics SSU1N50BTU technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-251-3 Short Leads, IPak, TO-251AA
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:I-PAK
- Power Dissipation ( Max):2.5W (Ta), 26W (Tc)
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):520 V
- Current - Continuous Drain ( Id) @ 25° C:1.3A (Tc)
- Rds On ( Max) @ Id, Vgs:5.3Ohm @ 650mA, 10V
- Vgs(th) ( Max) @ Id:4V @ 250µA
- Gate Charge ( Qg) ( Max) @ Vgs:11 nC @ 10 V
- Input Capacitance ( Ciss) ( Max) @ Vds:340 pF @ 25 V
- Drive Voltage ( Max Rds On, Min Rds On):10V
- Vgs ( Max):±30V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SSU1N50BTU provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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