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Onsemi MC100E210FNR2
Manufacturer # :MC100E210FNR2
Manufacturer :Onsemi
Dasenic # :MC100E210FNR2-DS
Datasheet : MC100E210FNR2 Datasheet
Customer # :
Description : IC CLK BUF 1:4/1:5 700MHZ 28PLCC
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In Stock: 53139
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
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MC100E210FNR2 information
Onsemi MC100E210FNR2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Type:Fanout Buffer (Distribution)
- Supplier Device Package:28-PLCC (11.51x11.51)
- Frequency - Max:700 MHz
- Number of Circuits:2
- Output:ECL, PECL
- Voltage - Supply:4.2V ~ 5.7V
- Input:ECL, PECL
- Ratio - Input: Output:1:4, 1:5
- Differential - Input: Output:Yes/Yes
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC100E210FNR2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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