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Onsemi KAC-12040-CBA-JD-AA

IMAGE SENSOR 12MP CMOS 267CPGA
part number has RoHS
Manufacturer # :KAC-12040-CBA-JD-AA
Manufacturer :Onsemi
Dasenic # :KAC-12040-CBA-JD-AA-DS
Customer # :
Description : IMAGE SENSOR 12MP CMOS 267CPGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2917.4200$ 2917.42
In Stock: 2774
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2917.42
Total :$ 2917.42
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KAC-12040-CBA-JD-AA information

  • Onsemi KAC-12040-CBA-JD-AA technical specifications, attributes, parameters.
  • Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
  • Product Status:Obsolete
  • Operating Temperature:-50°C ~ 80°C (TA)
  • Package / Case:237-XFCPGA
  • Type:CMOS
  • Supplier Device Package:237-MicroCPGA (42.5x38.1)
  • Voltage - Supply:1.8V, 2V
  • Frames per Second:70
  • Pixel Size:4.7µm x 4.7µm
  • Active Pixel Array:4000H x 3000V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
KAC-12040-CBA-JD-AA provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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