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Rochester Electronics FSFR1700XSL
Manufacturer # :FSFR1700XSL
Manufacturer :Rochester Electronics
Dasenic # :FSFR1700XSL-DS
Datasheet : FSFR1700XSL Datasheet
Customer # :
Description : IC OFFLINE SW HALF-BRIDGE 9SIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 20599
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.8
Total :$ 1.80
Delivery :
Payment :
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FSFR1700XSL information
Rochester Electronics FSFR1700XSL technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
- Product Status:Active
- Operating Temperature:-40°C ~ 130°C (TJ)
- Mounting Type:Through Hole
- Package / Case:10-SIP Module, 9 Leads, Formed Leads
- Supplier Device Package:9-SIP (L forming)
- Voltage - Breakdown:500V
- Power ( Watts):200 W
- Internal Switch(s):Yes
- Voltage - Supply ( Vcc/ Vdd):10V ~ 25V
- Frequency - Switching:Up to 300kHz
- Output Isolation:Isolated
- Topology:Half-Bridge
- Voltage - Start Up:12.5 V
- Duty Cycle:50%
- Fault Protection:Current Limiting, Over Temperature, Over Voltage
- Control Features:Frequency Control
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FSFR1700XSL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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