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Rochester Electronics FAN3850TUC13X35
CONSUMER CIRCUIT, CMOS, PBGA6
Manufacturer # :FAN3850TUC13X35
Manufacturer :Rochester Electronics
Dasenic # :FAN3850TUC13X35-DS
Datasheet :
FAN3850TUC13X35 Datasheet
FAN3850TUC13X35 DatasheetCustomer # :
Description : CONSUMER CIRCUIT, CMOS, PBGA6
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.1365 | $ 0.14 |
| 25+ | $ 0.1338 | $ 3.35 |
| 100+ | $ 0.1283 | $ 12.83 |
| 500+ | $ 0.1229 | $ 61.45 |
| 1000+ | $ 0.1160 | $ 116 |
In Stock: 20520
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1365
Total :$ 0.14
Delivery :
Payment :
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FAN3850TUC13X35 information
Rochester Electronics FAN3850TUC13X35 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-30°C ~ 85°C (TA)
- Features:ADC, Microphone
- Mounting Type:Surface Mount
- Package / Case:6-XFBGA, WLCSP
- Type:Class AB
- Output Type:1-Channel (Mono)
- Supplier Device Package:6-WLCSP (1.26x0.86)
- Voltage - Supply:1.64V ~ 3.63V
- Max Output Power x Channels @ Load:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FAN3850TUC13X35 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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