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Onsemi ESD8111PFCT5G

TVS DIODE 3.3VWM 8VC 2WLCSP
part number has RoHS
Manufacturer # :ESD8111PFCT5G
Manufacturer :Onsemi
Dasenic # :ESD8111PFCT5G-DS
Customer # :
Description : TVS DIODE 3.3VWM 8VC 2WLCSP 2-XFBGA, WLCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 4724
MOQ :1 PCS
Packaging :2-XFBGA, WLCSP
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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ESD8111PFCT5G information

  • Onsemi ESD8111PFCT5G technical specifications, attributes, parameters.
  • Category:Circuit Protection Devices/TVS - Diodes
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:2-XFBGA, WLCSP
  • Type:Zener
  • Capacitance @ Frequency:0.2pF @ 1MHz
  • Supplier Device Package:2-WLCSP (0.6x0.3)
  • Unidirectional Channels:-
  • Voltage - Reverse Standoff ( Typ):3.3V (Max)
  • Voltage - Breakdown ( Min):5.5V
  • Voltage - Clamping ( Max) @ Ipp:8V
  • Current - Peak Pulse (10/1000µs):7.1A (8/20µs)
  • Power - Peak Pulse:-
  • Power Line Protection:No
  • Bidirectional Channels:1
  • Applications:USB
ESD8111PFCT5G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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