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1 : $36.0090
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Onsemi AR1820HSSC00SHEA0-DP1
IMAGE SENSOR 18MP 1/2.3 CIS
Manufacturer # :AR1820HSSC00SHEA0-DP1
Manufacturer :Onsemi
Dasenic # :AR1820HSSC00SHEA0-DP1-DS
Datasheet :
AR1820HSSC00SHEA0-DP1 Datasheet
AR1820HSSC00SHEA0-DP1 DatasheetCustomer # :
Description : IMAGE SENSOR 18MP 1/2.3 CIS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 36.0090 | $ 36.01 |
In Stock: 3363
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 36.009
Total :$ 36.01
Delivery :
Payment :
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AR1820HSSC00SHEA0-DP1 information
Onsemi AR1820HSSC00SHEA0-DP1 technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Active
- Operating Temperature:-
- Package / Case:60-LBGA
- Type:CMOS
- Supplier Device Package:60-IBGA (10x10)
- Voltage - Supply:1.8V, 2.8V
- Frames per Second:60
- Pixel Size:1.34µm x 1.34µm
- Active Pixel Array:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AR1820HSSC00SHEA0-DP1 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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