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Onsemi AR0330CS1C12SPKA0-CP2

3 MP 1/3 CIS
part number has RoHS
Manufacturer # :AR0330CS1C12SPKA0-CP2
Manufacturer :Onsemi
Dasenic # :AR0330CS1C12SPKA0-CP2-DS
Customer # :
Description : 3 MP 1/3 CIS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 35.0000$ 35
25+$ 34.3000$ 857.5
100+$ 32.9000$ 3290
500+$ 31.5000$ 15750
1000+$ 29.7600$ 29760
In Stock: 1510
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 35
Total :$ 35.00
Delivery :
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AR0330CS1C12SPKA0-CP2 information

  • Onsemi AR0330CS1C12SPKA0-CP2 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
  • Product Status:Active
  • Operating Temperature:-30°C ~ 70°C (TJ)
  • Package / Case:61-WFBGA, CSPBGA
  • Type:CMOS
  • Supplier Device Package:61-ODCSP (6.28x6.65)
  • Voltage - Supply:1.7V ~ 1.9V, 2.7V ~ 2.9V
  • Frames per Second:30
  • Pixel Size:2.2µm x 2.2µm
  • Active Pixel Array:2304H x 1536V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AR0330CS1C12SPKA0-CP2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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