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Onsemi 74VHCT245AMTC
Manufacturer # :74VHCT245AMTC
Manufacturer :Onsemi
Dasenic # :74VHCT245AMTC-DS
Datasheet : 74VHCT245AMTC Datasheet
Customer # :
Description : IC BUF NON-INVERT 5.5V 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10330
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1719
Total :$ 0.17
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Onsemi 74VHCT245AMTC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Buffers, Drivers, Receivers, Transceivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-TSSOP (0.173", 4.40mm Width)
- Input Type:-
- Output Type:3-State
- Supplier Device Package:20-TSSOP
- Number of Elements:1
- Voltage - Supply:4.5V ~ 5.5V
- Logic Type:Buffer, Non-Inverting
- Number of Bits per Element:8
- Current - Output High, Low:8mA, 8mA
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
74VHCT245AMTC provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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