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Rochester Electronics 74AC11PC

IC GATE AND 3CH 3-INP 14DIP
part number has RoHS
Manufacturer # :74AC11PC
Manufacturer :Rochester Electronics
Dasenic # :74AC11PC-DS
Customer # :
Description : IC GATE AND 3CH 3-INP 14DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2730$ 0.27
25+$ 0.2675$ 6.69
100+$ 0.2566$ 25.66
500+$ 0.2457$ 122.85
1000+$ 0.2320$ 232
In Stock: 10293
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.273
Total :$ 0.27
Delivery :
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Payment :
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74AC11PC information

  • Rochester Electronics 74AC11PC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gates and Inverters
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Through Hole
  • Package / Case:14-DIP (0.300", 7.62mm)
  • Supplier Device Package:14-DIP
  • Number of Circuits:3
  • Voltage - Supply:2V ~ 6V
  • Number of Inputs:3
  • Current - Quiescent ( Max):2 µA
  • Logic Type:AND Gate
  • Current - Output High, Low:24mA, 24mA
  • Max Propagation Delay @ V, Max C L:8ns @ 5V, 50pF
  • Logic Level - Low:0.9V ~ 1.65V
  • Logic Level - High:2.1V ~ 3.85V
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74AC11PC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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