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Rochester Electronics SPC5517EBVLQ66
Manufacturer # :SPC5517EBVLQ66
Manufacturer :Rochester Electronics
Dasenic # :SPC5517EBVLQ66-DS
Datasheet : SPC5517EBVLQ66 Datasheet
Customer # :
Description : IC MCU 32BIT 1.5MB FLASH 144LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1800
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 39.618
Total :$ 39.62
Delivery :
Payment :
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SPC5517EBVLQ66 information
Rochester Electronics SPC5517EBVLQ66 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:144-LQFP
- Supplier Device Package:144-LQFP (20x20)
- Peripherals:DMA, POR, PWM, WDT
- Number of I/ O:111
- Speed:66MHz
- E E P R O M Size:-
- Core Processor:e200z0, e200z1
- R A M Size:80K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Dual-Core
- Connectivity:CANbus, EBI/EMI, I²C, SCI, SPI
- Program Memory Size:1.5MB (1.5M x 8)
- Voltage - Supply ( Vcc/ Vdd):4.5V ~ 5.25V
- Data Converters:A/D 40x12b
- Oscillator Type:Internal
- HTS US:0000.00.0000
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SPC5517EBVLQ66 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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