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Rochester Electronics MPC860ENCZQ50D4

POWERQUICC 32 BIT POWER ARCHITEC
part number has RoHS
Manufacturer # :MPC860ENCZQ50D4
Manufacturer :Rochester Electronics
Dasenic # :MPC860ENCZQ50D4-DS
Customer # :
Description : POWERQUICC 32 BIT POWER ARCHITEC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 91.4580$ 91.46
100+$ 90.5400$ 9054
In Stock: 10301
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 91.458
Total :$ 91.46
Delivery :
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Payment :
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MPC860ENCZQ50D4 information

  • Rochester Electronics MPC860ENCZQ50D4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:-40°C ~ 95°C (TJ)
  • Package / Case:357-BBGA
  • Supplier Device Package:357-PBGA (25x25)
  • Voltage - I/ O:3.3V
  • Speed:50MHz
  • Core Processor:MPC8xx
  • Number of Cores/ Bus Width:1 Core, 32-Bit
  • Co- Processors/ D S P:Communications; CPM
  • R A M Controllers:DRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10Mbps (4)
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MPC860ENCZQ50D4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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