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Rochester Electronics MC68302RC25C
Manufacturer # :MC68302RC25C
Manufacturer :Rochester Electronics
Dasenic # :MC68302RC25C-DS
Datasheet : MC68302RC25C Datasheet
Customer # :
Description : MC68302 - INTEGRATED MULTI-PROTO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1540
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 125.505
Total :$ 125.50
Delivery :
Payment :
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MC68302RC25C information
Rochester Electronics MC68302RC25C technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Package / Case:132-BFPGA
- Supplier Device Package:132-PGA (39.63x39.63)
- Voltage - I/ O:5V
- Speed:25MHz
- Core Processor:M68000
- Number of Cores/ Bus Width:1 Core, 8-Bit, 16-Bit
- Co- Processors/ D S P:Communications; RISC CPM
- R A M Controllers:DRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- S A T A:-
- U S B:-
- Security Features:-
- EU RoHS Status:RoHS non-compliant
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:3A991
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC68302RC25C provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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