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Rochester Electronics EPF10K200SRC240-2
IC FPGA 182 I/O 240RQFP
Manufacturer # :EPF10K200SRC240-2
Manufacturer :Rochester Electronics
Dasenic # :EPF10K200SRC240-2-DS
Datasheet :
EPF10K200SRC240-2 Datasheet
EPF10K200SRC240-2 DatasheetCustomer # :
Description : IC FPGA 182 I/O 240RQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 432.9810 | $ 432.98 |
| 25+ | $ 424.3230 | $ 10608.08 |
| 100+ | $ 406.9980 | $ 40699.8 |
| 500+ | $ 389.6820 | $ 194841 |
| 1000+ | $ 368.0370 | $ 368037 |
In Stock: 1690
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 432.981
Total :$ 432.98
Delivery :
Payment :
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EPF10K200SRC240-2 information
Rochester Electronics EPF10K200SRC240-2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:240-BFQFP
- Supplier Device Package:240-RQFP (32x32)
- Voltage - Supply:2.375V ~ 2.625V
- Number of I/ O:182
- Number of L A Bs/ C L Bs:1248
- Number of Logic Elements/ Cells:9984
- Number of gates:513000
- Total R A M bits:98304
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K200SRC240-2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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