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Rochester Electronics EP1S30B956C6
IC FPGA 683 I/O 956BGA
Manufacturer # :EP1S30B956C6
Manufacturer :Rochester Electronics
Dasenic # :EP1S30B956C6-DS
Datasheet :
EP1S30B956C6 Datasheet
EP1S30B956C6 DatasheetCustomer # :
Description : IC FPGA 683 I/O 956BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2400.0200 | $ 2400.02 |
| 25+ | $ 2352.0200 | $ 58800.5 |
| 100+ | $ 2256.0200 | $ 225602 |
| 500+ | $ 2160.0200 | $ 1080010 |
| 1000+ | $ 2040.0200 | $ 2040020 |
In Stock: 1505
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2400.02
Total :$ 2400.02
Delivery :
Payment :
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EP1S30B956C6 information
Rochester Electronics EP1S30B956C6 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:956-BBGA, FCBGA
- Supplier Device Package:956-BGA (40x40)
- Voltage - Supply:1.425V ~ 1.575V
- Number of I/ O:683
- Number of L A Bs/ C L Bs:3247
- Number of Logic Elements/ Cells:32470
- Number of gates:-
- Total R A M bits:3317184
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP1S30B956C6 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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