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Rochester Electronics IRGP4078D-EPBF
Manufacturer # :IRGP4078D-EPBF
Manufacturer :Rochester Electronics
Dasenic # :IRGP4078D-EPBF-DS
Datasheet : IRGP4078D-EPBF Datasheet
Customer # :
Description : INSULATED GATE BIPOLAR GATE TRAS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 11790
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.709
Total :$ 2.71
Delivery :
Payment :
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IRGP4078D-EPBF information
Rochester Electronics IRGP4078D-EPBF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 175°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Input Type:Standard
- Power - Max:278 W
- Supplier Device Package:TO-247AD
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):74 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:Trench
- Vce(on) ( Max) @ Vge, Ic:2.2V @ 15V, 50A
- Current - Collector Pulsed ( Icm):150 A
- Switching Energy:1.1mJ (off)
- Gate Charge:92 nC
- Td (on/off) @ 25° C:-/116ns
- Test Condition:400V, 50A, 10Ohm, 15V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IRGP4078D-EPBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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