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Rochester Electronics IR3101

IR3101 - INTELLIGENT POWER MODUL
part number has RoHS
Manufacturer # :IR3101
Manufacturer :Rochester Electronics
Dasenic # :IR3101-DS
Customer # :
Description : IR3101 - INTELLIGENT POWER MODUL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.0800$ 3.08
25+$ 3.0200$ 75.5
100+$ 2.9000$ 290
500+$ 2.7800$ 1390
1000+$ 2.6200$ 2620
In Stock: 1218
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.08
Total :$ 3.08
Delivery :
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  • Rochester Electronics IR3101 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gate Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:11-SIP, 9 Leads
  • Input Type:Non-Inverting
  • Supplier Device Package:11-SIP
  • Voltage - Supply:10V ~ 20V
  • Channel Type:Independent
  • Driven Configuration:Half-Bridge
  • Number of Drivers:2
  • Gate Type:N-Channel MOSFET
  • Logic Voltage - V I L, V I H:0.8V, 2.9V
  • Current - Peak Output ( Source, Sink):-
  • High Side Voltage - Max ( Bootstrap):500 V
  • Rise / Fall Time ( Typ):-
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
IR3101 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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